(footprint "TFBGA-265_14x14mm_Layout17x17_P0.8mm" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5ADF9FCE)
  (descr "TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.8mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf")
  (tags "BGA 265 0.8")
  (attr smd)
  (fp_text reference "REF**" (at 0 -8) (layer "F.SilkS")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 6ec43fb3-a34e-4206-bd1b-ead0d3968c3d)
  )
  (fp_text value "TFBGA-265_14x14mm_Layout17x17_P0.8mm" (at 0 8) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp c1bf619a-17d2-4c5c-aec7-b0ec4bf306e7)
  )
  (fp_text user "${REFERENCE}" (at 0 0) (layer "F.Fab")
    (effects (font (size 1 1) (thickness 0.15)))
    (tstamp 3d101a16-8454-4ab0-b888-a55e05b508a1)
  )
  (fp_line (start 7.125 -7.125) (end 7.125 7.125) (layer "F.SilkS") (width 0.12) (tstamp 53bf2677-e1ea-40ba-b90f-c4f76642833b))
  (fp_line (start -7.125 7.125) (end -7.125 -6.125) (layer "F.SilkS") (width 0.12) (tstamp ce61c34b-274e-4986-a9e5-8ffbcc622c1d))
  (fp_line (start 7.125 7.125) (end -7.125 7.125) (layer "F.SilkS") (width 0.12) (tstamp d5d47321-395b-4678-b1d4-c9c7032c2947))
  (fp_line (start -6.125 -7.125) (end 7.125 -7.125) (layer "F.SilkS") (width 0.12) (tstamp daba1e3d-1a34-494f-9888-d312e34391cc))
  (fp_line (start -8 8) (end 8 8) (layer "F.CrtYd") (width 0.05) (tstamp 398b222f-2fe4-4f3e-94ec-dfa952b0c82b))
  (fp_line (start -8 -8) (end -8 8) (layer "F.CrtYd") (width 0.05) (tstamp 8bc2fe4d-c8b2-449b-b599-118c118350fa))
  (fp_line (start 8 8) (end 8 -8) (layer "F.CrtYd") (width 0.05) (tstamp 94d49575-b003-45f7-b162-7d820891bddd))
  (fp_line (start 8 -8) (end -8 -8) (layer "F.CrtYd") (width 0.05) (tstamp cf098ddd-c6cd-4068-b30b-42c5075954d1))
  (fp_line (start -6 -7) (end 7 -7) (layer "F.Fab") (width 0.1) (tstamp 674b7e7c-5cfb-4195-84f5-67e68f23b44a))
  (fp_line (start -7 -6) (end -6 -7) (layer "F.Fab") (width 0.1) (tstamp 89cdfd74-035c-4850-b7b6-4f27288f44ed))
  (fp_line (start -7 7) (end -7 -6) (layer "F.Fab") (width 0.1) (tstamp 8a731b36-daa2-4f07-99b3-10bfa16c3c39))
  (fp_line (start 7 7) (end -7 7) (layer "F.Fab") (width 0.1) (tstamp da6b26a2-ff49-44f5-9f0c-526812360fa2))
  (fp_line (start 7 -7) (end 7 7) (layer "F.Fab") (width 0.1) (tstamp f203e506-8d36-41c2-aeff-6a58f60ac72a))
  (pad "A1" smd circle (at -6.4 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 98ac67be-ae81-4498-ba4f-1d8c263581ff))
  (pad "A2" smd circle (at -5.6 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 35214ceb-ddd3-415a-aba6-a77e4b55466f))
  (pad "A3" smd circle (at -4.8 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 4c9f04b3-2987-4d19-a154-37bf31756369))
  (pad "A4" smd circle (at -4 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 4ad5a155-bd0e-40d1-89fd-d6937c191fdd))
  (pad "A5" smd circle (at -3.2 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp da16e395-b9ce-4f2a-9b0b-c6ee08a0489d))
  (pad "A6" smd circle (at -2.4 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp d86470ab-d31f-43e3-a754-4429fd6f9b02))
  (pad "A7" smd circle (at -1.6 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 9f4745eb-6fb3-4b22-939e-607163f5d8d1))
  (pad "A8" smd circle (at -0.8 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 838f9295-3f4d-42b8-b939-43aa943b0a0a))
  (pad "A9" smd circle (at 0 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 5b941832-de9a-49ad-9bfe-5f4ca243a199))
  (pad "A10" smd circle (at 0.8 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp d4577805-d99a-41b2-a691-f63dda6cae7a))
  (pad "A11" smd circle (at 1.6 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 95ef62d6-edb5-46a2-8007-80f05390d298))
  (pad "A12" smd circle (at 2.4 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 8c9776df-9ef6-4110-9d10-be532ed8257a))
  (pad "A13" smd circle (at 3.2 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp dc5d2acb-7349-494a-ab36-a3117751d19a))
  (pad "A14" smd circle (at 4 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp d92e6599-9311-4d2f-bda5-5c92f32d5216))
  (pad "A15" smd circle (at 4.8 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 34327c24-06b0-442c-a877-cd1870c10fec))
  (pad "A16" smd circle (at 5.6 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 37896300-9548-4106-a7a5-414e6ea134dd))
  (pad "A17" smd circle (at 6.4 -6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 55f43c26-4d22-46ed-aeb1-2ef7606583b7))
  (pad "B1" smd circle (at -6.4 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 4dd7035a-9e1e-4942-a950-9901fd084174))
  (pad "B2" smd circle (at -5.6 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 0291852f-d346-4a5e-ac6b-f12d72229b9d))
  (pad "B3" smd circle (at -4.8 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 0d0b9e96-c72b-4c13-bc02-8b93b7e38088))
  (pad "B4" smd circle (at -4 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 2505df44-9560-463c-84f2-eb40f674dad3))
  (pad "B5" smd circle (at -3.2 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 7fd52a47-bd65-4f24-bd2b-241fc62610cc))
  (pad "B6" smd circle (at -2.4 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp ac970db0-8391-4868-bd4e-8708e6a724a3))
  (pad "B7" smd circle (at -1.6 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 710ece1d-5782-40a6-a100-7bb6367ae69e))
  (pad "B8" smd circle (at -0.8 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 42e3a4f3-b057-4be0-870c-f100e7f972dd))
  (pad "B9" smd circle (at 0 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 23d8a306-1935-4301-a3e5-62e6cf9c4ddb))
  (pad "B10" smd circle (at 0.8 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp ab356853-e32a-4b6e-b7f7-7ea44e6ba2ed))
  (pad "B11" smd circle (at 1.6 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 0f26b0c9-2f90-472b-a138-cbdc37c703ff))
  (pad "B12" smd circle (at 2.4 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 63d55d4c-ca31-422c-893c-7320ae133d5d))
  (pad "B13" smd circle (at 3.2 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 055d742c-3e7e-4e00-bd97-bf05bb26e052))
  (pad "B14" smd circle (at 4 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 0f2e2aae-3209-4d93-8bb3-39fb43be4071))
  (pad "B15" smd circle (at 4.8 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 28aa9356-b269-4db5-beb6-f793b822d357))
  (pad "B16" smd circle (at 5.6 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 6426cfa1-1399-41f7-8e87-60fd56e21353))
  (pad "B17" smd circle (at 6.4 -5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 9dcc4342-8e49-4830-8b37-680d0c68d89c))
  (pad "C1" smd circle (at -6.4 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 8e770f98-7a1a-4197-89b1-8ad81f1d707d))
  (pad "C2" smd circle (at -5.6 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp be6205ad-96ee-4a9a-8b6a-81d696062b58))
  (pad "C3" smd circle (at -4.8 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp ed71c91e-4d2e-43a7-bfb4-ee46187aaa54))
  (pad "C4" smd circle (at -4 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 31442612-db05-42cc-b0b6-5be29cd31d57))
  (pad "C5" smd circle (at -3.2 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 8866da56-e2e6-4cce-8556-b7d59c65ec96))
  (pad "C6" smd circle (at -2.4 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C7" smd circle (at -1.6 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C8" smd circle (at -0.8 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C9" smd circle (at 0 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp b4e1db81-c7dd-4779-8bd1-d1975db9c26b))
  (pad "C10" smd circle (at 0.8 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp a8a8bb28-e73d-40ca-b334-09e6deeacdba))
  (pad "C11" smd circle (at 1.6 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C12" smd circle (at 2.4 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "C17" smd circle (at 6.4 -4.8) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp bc26e71d-a507-45ed-814b-a169cc73af25))
  (pad "D1" smd circle (at -6.4 -4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "D6" smd circle (at -2.4 -4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "D8" smd circle (at -0.8 -4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "D10" smd circle (at 0.8 -4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "D11" smd circle (at 1.6 -4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "D12" smd circle (at 2.4 -4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "D13" smd circle (at 3.2 -4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp d4960362-6758-49ed-a257-08a9ffa2017c))
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  (pad "D15" smd circle (at 4.8 -4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "D16" smd circle (at 5.6 -4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 2406d3ba-1b4b-4129-b863-995d4665dfde))
  (pad "D17" smd circle (at 6.4 -4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp fddd5c23-aa3b-4201-9616-6c25cd79b408))
  (pad "E1" smd circle (at -6.4 -3.2) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp e0d2a8c0-7ca9-419a-880e-a2f75e6f1ddd))
  (pad "E2" smd circle (at -5.6 -3.2) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "E3" smd circle (at -4.8 -3.2) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "E4" smd circle (at -4 -3.2) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
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    (solder_paste_margin_ratio -0.115) (tstamp 37ca6148-f609-44ab-815a-4e94da8e36d6))
  (pad "T14" smd circle (at 4 5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 0f8114d5-7f5d-4402-a9b7-f7b088fadb9b))
  (pad "T15" smd circle (at 4.8 5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 79f512f1-c074-4272-97dd-b2780eb9c521))
  (pad "T16" smd circle (at 5.6 5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp e67c3305-6da4-4fb6-97ef-6d16425948ca))
  (pad "T17" smd circle (at 6.4 5.6) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp f45ae8fb-f826-49ac-96e4-6f7161b74f21))
  (pad "U1" smd circle (at -6.4 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp fbf945c2-fb57-4326-99f4-3f6202d77ff1))
  (pad "U2" smd circle (at -5.6 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp df307e22-d8aa-475f-866b-e255b549e310))
  (pad "U3" smd circle (at -4.8 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 3e51d50f-a985-40de-ba0e-628f6b88e3e2))
  (pad "U4" smd circle (at -4 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp a7255f9c-60ab-4661-9fc0-79ead074ba51))
  (pad "U5" smd circle (at -3.2 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp e5ef01a8-aae1-4324-83ce-6d85a5cb8c5f))
  (pad "U6" smd circle (at -2.4 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 633fdf90-1ea4-4b50-9c2d-719956b0bfac))
  (pad "U7" smd circle (at -1.6 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp c418eb6c-c318-4861-a245-a82c9d20ec59))
  (pad "U8" smd circle (at -0.8 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp ac80fc38-80fa-43ce-9c1d-b562433000f0))
  (pad "U9" smd circle (at 0 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 6b767b60-f0d3-42c1-b3e3-d86965a90aba))
  (pad "U10" smd circle (at 0.8 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 5f028d41-d749-4439-9dda-b56aaad4ca25))
  (pad "U11" smd circle (at 1.6 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp d13d6e72-e510-4272-bfd5-f9117100055a))
  (pad "U12" smd circle (at 2.4 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 9c82f734-65a8-4d77-b2bc-8bebe3bc590e))
  (pad "U13" smd circle (at 3.2 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 9a70bd83-922f-4b6b-b7b9-8fb2626f1214))
  (pad "U14" smd circle (at 4 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 33e2260b-da38-40cd-918b-ff7f5cf711ee))
  (pad "U15" smd circle (at 4.8 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 382c9263-64b3-4c34-8b1b-11af66def0d3))
  (pad "U16" smd circle (at 5.6 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 573d5c77-1fee-4adb-b094-f0caca26320a))
  (pad "U17" smd circle (at 6.4 6.4) (size 0.325 0.325) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio -0.115) (tstamp 753935a1-2579-420c-81ce-da7abcff4225))
  (model "${KICAD6_3DMODEL_DIR}/Package_BGA.3dshapes/TFBGA-265_14x14mm_Layout17x17_P0.8mm.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
