(footprint "ST_WLCSP-143_Die449" (version 20211014) (generator pcbnew)
  (layer "F.Cu")
  (tedit 5AE11EAD)
  (descr "WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf")
  (tags "BGA 143 0.4")
  (attr smd)
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    (tstamp 131296be-74da-4536-a5f1-a7a1d9d1cc6b)
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  (pad "N8" smd circle (at 0.8 2.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
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  (pad "N9" smd circle (at 1.2 2.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp da028ba4-3e7d-433c-ade3-7a2776af1d38))
  (pad "N10" smd circle (at 1.6 2.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp 36a67569-41e2-4d4a-a522-eaf0fadf4645))
  (pad "N11" smd circle (at 2 2.4) (size 0.225 0.225) (layers "F.Cu" "F.Paste" "F.Mask")
    (solder_paste_margin_ratio 0.055556) (tstamp d628b860-2598-472b-950a-91f15926e945))
  (model "${KICAD6_3DMODEL_DIR}/Package_CSP.3dshapes/ST_WLCSP-143_Die449.wrl"
    (offset (xyz 0 0 0))
    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
  )
)
